As those who have worked with the SST/R90's know getting 20+ watts out of a contact area of ~46 mm^2 is a challenge. The Luminus Devices star and other metal circuit board designs are a good answer if you can incorporate the form factor. For my helmet light design I decided to use a copper disk between the SST90 device and the aluminum housing.
Indium solder has a conductivity of ~70 w/mk compared to 63/37 lead tin at ~50 w/mk or Bismuth tin at ~20 w/mk. I use this Tix solder.
Indium can NOT be soldered to copper directly due to the formation of a brittle alloy. It is recommended to plate the copper with nickel first. This is the nickel plating kit I bought from Caswell.
The first step is to sand the copper disk flat. I use 320 W/D paper taped to a milled iron platen. Sand unti all the machining marks are gone.
Next Clean, clean, clean. Do the water sheeting test. Don't touch the mounting surface from this point on.
Now I plate the mounting area with the Caswell kit. Keep the tip wet and in motion. You don't have to rub, just go around the area in a continuous circular motion. This is the result ... as best as I could photograph it.
Now I solder the power wires to the SST90 with lead free solder. This solder melts at about 220 degC so the wires won't fall off when I use the Indium solder that melts at 135 degC.
The jig is machined from glass filled teflon and can take ~275 degC.
I now flow the Indium solder on the SST90 thermal pad. I calculater the length of solder wire necessary to coat the area with 2 mills (0,05 mm). This was a guess and seems to work out good. I see a little extra solder at the ends after reflow. I bend the solder wire sharply at 1/2" so I know how much to lay down. The complete thermal area should be covered with solder. Now I load the prepared SST90 into the second jig.
The hot plate is turned on and set for 180 degC and the copper disk is placed on top of the SST90 in the jig. The jig is then flipped and set on the hot plate.
The reflow took almost 5 minutes so I have to try to speed that up but no harm will be done at 180 degC. Some thermal compound might give me a better coupling to the hot plate but would make a mess. I did not wait long enough before moving this assembly and it skewed. I just reheated it and it straightened out. ( no picture proof ... sorry).
This is a 3D cross section of my helmet light showing the SST90 / copper disk mounting.
I will be inserting thermal sensors into a prototype light to measure the heat flow as best I can. The plots should be interesting ... stay tuned.
Indium solder has a conductivity of ~70 w/mk compared to 63/37 lead tin at ~50 w/mk or Bismuth tin at ~20 w/mk. I use this Tix solder.
Indium can NOT be soldered to copper directly due to the formation of a brittle alloy. It is recommended to plate the copper with nickel first. This is the nickel plating kit I bought from Caswell.
The first step is to sand the copper disk flat. I use 320 W/D paper taped to a milled iron platen. Sand unti all the machining marks are gone.
Next Clean, clean, clean. Do the water sheeting test. Don't touch the mounting surface from this point on.
Now I plate the mounting area with the Caswell kit. Keep the tip wet and in motion. You don't have to rub, just go around the area in a continuous circular motion. This is the result ... as best as I could photograph it.
Now I solder the power wires to the SST90 with lead free solder. This solder melts at about 220 degC so the wires won't fall off when I use the Indium solder that melts at 135 degC.
The jig is machined from glass filled teflon and can take ~275 degC.
I now flow the Indium solder on the SST90 thermal pad. I calculater the length of solder wire necessary to coat the area with 2 mills (0,05 mm). This was a guess and seems to work out good. I see a little extra solder at the ends after reflow. I bend the solder wire sharply at 1/2" so I know how much to lay down. The complete thermal area should be covered with solder. Now I load the prepared SST90 into the second jig.
The hot plate is turned on and set for 180 degC and the copper disk is placed on top of the SST90 in the jig. The jig is then flipped and set on the hot plate.
The reflow took almost 5 minutes so I have to try to speed that up but no harm will be done at 180 degC. Some thermal compound might give me a better coupling to the hot plate but would make a mess. I did not wait long enough before moving this assembly and it skewed. I just reheated it and it straightened out. ( no picture proof ... sorry).
This is a 3D cross section of my helmet light showing the SST90 / copper disk mounting.
I will be inserting thermal sensors into a prototype light to measure the heat flow as best I can. The plots should be interesting ... stay tuned.