Web Site: ScienceDaily Magazine
Page URL: http://www.sciencedaily.com/releases/2003/07/030714092651.htm
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Original Source: University At Buffalo
Date Posted: 2003-07-14
Thermal Paste To Help Minimize Overheating In Electronic Devices
A materials engineer at the University at Buffalo has invented a new thermal paste that will help solve the problem of overheating in high-performance personal computers and other electronics.
Created by Deborah Chung, Niagara Mohawk Professor of Materials Research in the UB School of Engineering and Applied Sciences, the paste, when applied between a heat sink and a heat source, can greatly improve the conduction of heat from the heat source to the heat sink. Heat sinks are widely used in electronics to draw away heat produced by the device and prevent the device from overheating. "Heat dissipation is the most critical problem in the electronics industry because it limits the performance, speed and further miniaturization of microelectronics," Chung explains.
In comparative laser-flash testing, Chung's thermal paste--composed of carbon-filled organic material--performed better than the leading thermal pastes currently on the market. The results of the testing and the makeup Chung's paste will be described in a forthcoming issue of the journal Carbon.
"The invented material is superior to all other thermal pastes, including those involving exotic materials such as carbon nanotubes and diamond. It even significantly surpasses solder-the best material currently available-for improving the thermal contact between two surfaces," Chung says.
The development of heat sink materials has received much attention for the alleviation of the over-heating problem, she notes. Development of thermal pastes for improving the thermal contact between the heat source and the heat sink has received relatively little attention, however.
Without a good thermal paste, the use of an expensive heat sink material is not worthwhile, according to Chung.
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Note: This story has been adapted from a news release issued by University At Buffalo.
Page URL: http://www.sciencedaily.com/releases/2003/07/030714092651.htm
--------------------------------------------------------------------------------
Original Source: University At Buffalo
Date Posted: 2003-07-14
Thermal Paste To Help Minimize Overheating In Electronic Devices
A materials engineer at the University at Buffalo has invented a new thermal paste that will help solve the problem of overheating in high-performance personal computers and other electronics.
Created by Deborah Chung, Niagara Mohawk Professor of Materials Research in the UB School of Engineering and Applied Sciences, the paste, when applied between a heat sink and a heat source, can greatly improve the conduction of heat from the heat source to the heat sink. Heat sinks are widely used in electronics to draw away heat produced by the device and prevent the device from overheating. "Heat dissipation is the most critical problem in the electronics industry because it limits the performance, speed and further miniaturization of microelectronics," Chung explains.
In comparative laser-flash testing, Chung's thermal paste--composed of carbon-filled organic material--performed better than the leading thermal pastes currently on the market. The results of the testing and the makeup Chung's paste will be described in a forthcoming issue of the journal Carbon.
"The invented material is superior to all other thermal pastes, including those involving exotic materials such as carbon nanotubes and diamond. It even significantly surpasses solder-the best material currently available-for improving the thermal contact between two surfaces," Chung says.
The development of heat sink materials has received much attention for the alleviation of the over-heating problem, she notes. Development of thermal pastes for improving the thermal contact between the heat source and the heat sink has received relatively little attention, however.
Without a good thermal paste, the use of an expensive heat sink material is not worthwhile, according to Chung.
--------------------------------------------------------------------------------
Note: This story has been adapted from a news release issued by University At Buffalo.
