I have just started building custom lights, and the heat generated by an XML at 2.8 amps in an EDC-size flashlight has led me to the conclusion that I need to put more thought into thermal management than just trying for a thin bondline when gluing a star to the heatsink with arctic alumina.
My first thought was to drill a hole in the center of the thermal pad on a star (one of the 8mm XML bare stars made by Datiled) that would allow the thermal pad of the emitter to be soldered directly to a copper heatsink with a small pedestal the size of the hole, so that's what I did. I drilled a 7/64" diameter through-hole centered on the thermal pad, and then tinned the star, and mounted an XML (first time reflow soldering, pucker factor was a little high). I used a lab hotplate and a thermocouple to manage the heat, and it seemed to work out, as the emitter lit up afterward.
Next step is to solder the star to a copper heatsink by way of the hole, which is about 0.0625" deep and now partially filled with solder from emitter mounting. I don't have any way to measure any increase in performance, but I wanted to put this out there to see if anyone had already done it, and if they found it was worth it for the increase in performance/reliability/comfort. I will have pictures up tomorrow; I'm having trouble getting a decent shot of such a small subject with out point and shoot.
One question I have for the resident thermal experts is whether I want to minimize the thickness of the solder layer between the emitter pad and the pedestal on the copper heatsink, which will be the only attachment point holding the star to the heatsink, or if I can forgo the pedestal and keep the heatsink flat. I will be lapping the star base flat to match a shallow pocket in the heatsink, and may or may not put thermal grease between the star and heatsink (surrounding the solder "via"). Sorry if this makes no sense, I will have pictures up soon.
My first thought was to drill a hole in the center of the thermal pad on a star (one of the 8mm XML bare stars made by Datiled) that would allow the thermal pad of the emitter to be soldered directly to a copper heatsink with a small pedestal the size of the hole, so that's what I did. I drilled a 7/64" diameter through-hole centered on the thermal pad, and then tinned the star, and mounted an XML (first time reflow soldering, pucker factor was a little high). I used a lab hotplate and a thermocouple to manage the heat, and it seemed to work out, as the emitter lit up afterward.
Next step is to solder the star to a copper heatsink by way of the hole, which is about 0.0625" deep and now partially filled with solder from emitter mounting. I don't have any way to measure any increase in performance, but I wanted to put this out there to see if anyone had already done it, and if they found it was worth it for the increase in performance/reliability/comfort. I will have pictures up tomorrow; I'm having trouble getting a decent shot of such a small subject with out point and shoot.
One question I have for the resident thermal experts is whether I want to minimize the thickness of the solder layer between the emitter pad and the pedestal on the copper heatsink, which will be the only attachment point holding the star to the heatsink, or if I can forgo the pedestal and keep the heatsink flat. I will be lapping the star base flat to match a shallow pocket in the heatsink, and may or may not put thermal grease between the star and heatsink (surrounding the solder "via"). Sorry if this makes no sense, I will have pictures up soon.
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