awenta
Enlightened
Just wondering what you guys like to use.
:wave:
:wave:
Thermal Potting/Encapsulating Compound
- Thread starter awenta
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awenta
Enlightened
:thumbsup:
There's very little reason to pot electronics. Unless you're looking to protect the components from exposure to elements or protect unsecured components from vibration, you're probably wasting time and effort.
Many believe that you can pour some magic liquid on components and have a solution to thermal issues, which is not the case. About the only people supportive of the thermal conduction properties of thermal compounds are the manufacturers of thermal compounds. The thermal compounds perform just about the same as standard potting compounds. It reminds me of a thermal grease comparison I saw a while back where peanut butter and saliva performed as well as some purpose-designed compounds.
If your goal is to conduct heat out of an electronic component, your best choice is to isolate which components are generating heat and develop heat sinking that provides an efficient thermal path. There are two rules of thumb in thermal conductivity. The first is that that all mating surfaces should be as flat and as smooth as possible. The second is that the thermal grease, adhesive or solder be as thin as conceivably possible. Lastly, moving heat is a wasted exercise unless you have a complete thermal path. That includes dispersing the heat out of the device. Otherwise all you're doing is moving heat and delaying the onset of thermal saturation.
As suggested, search "thermal compounds" as there was just some interesting discussion on this topic. You'll find other informative information in older threads as well. Also note the sticky on thermal management at the top of this subforum.
Many believe that you can pour some magic liquid on components and have a solution to thermal issues, which is not the case. About the only people supportive of the thermal conduction properties of thermal compounds are the manufacturers of thermal compounds. The thermal compounds perform just about the same as standard potting compounds. It reminds me of a thermal grease comparison I saw a while back where peanut butter and saliva performed as well as some purpose-designed compounds.
If your goal is to conduct heat out of an electronic component, your best choice is to isolate which components are generating heat and develop heat sinking that provides an efficient thermal path. There are two rules of thumb in thermal conductivity. The first is that that all mating surfaces should be as flat and as smooth as possible. The second is that the thermal grease, adhesive or solder be as thin as conceivably possible. Lastly, moving heat is a wasted exercise unless you have a complete thermal path. That includes dispersing the heat out of the device. Otherwise all you're doing is moving heat and delaying the onset of thermal saturation.
As suggested, search "thermal compounds" as there was just some interesting discussion on this topic. You'll find other informative information in older threads as well. Also note the sticky on thermal management at the top of this subforum.
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