It's hard to find Nichia 219 and I could only find Nichia 119.
Because no one make direct thermal mcpcb, I came up with an idea using nano diamond because diamond is electric insulators.
So I test it to 3535 led foot print first before use it to Nichia 119.
I make 1mm hole
Than fill it with nano diamond. I make the nano diamond power like soft breakable rubber/mud(taking advantage form nano diamond permeability). Than make it flat with razor blade.
I use 0.8mm tin solder, than smash it with hammer. Put little solder grease, and ready to solder. I use Osram led.
Than I test it, I don't know how good is it but it work. The Osram led is 1A max, I push it to 1.5A and the surface area around the led is only warm.
I remove the led to see how it looks after solder.
I solder again with Cree led. I don't know XP-G or XP-E, but I push it to 2A the surface area around the led is only warm.
I don't have equipment to measure how good is it. If anyone here who want to test it and has equipment to test it, I'll sent it to you.
Now I make another using 2 XML to know how hot is the surface area around the led.
And I'm thinking to reverse to process by:
make a hole - solder the led - fill the nano diamond from behind.
but I don't know how to seal it. Because I'm using aluminium MCPCB. Any idea?
Because no one make direct thermal mcpcb, I came up with an idea using nano diamond because diamond is electric insulators.
So I test it to 3535 led foot print first before use it to Nichia 119.
I make 1mm hole
Than fill it with nano diamond. I make the nano diamond power like soft breakable rubber/mud(taking advantage form nano diamond permeability). Than make it flat with razor blade.
I use 0.8mm tin solder, than smash it with hammer. Put little solder grease, and ready to solder. I use Osram led.
Than I test it, I don't know how good is it but it work. The Osram led is 1A max, I push it to 1.5A and the surface area around the led is only warm.
I remove the led to see how it looks after solder.
I solder again with Cree led. I don't know XP-G or XP-E, but I push it to 2A the surface area around the led is only warm.
I don't have equipment to measure how good is it. If anyone here who want to test it and has equipment to test it, I'll sent it to you.
Now I make another using 2 XML to know how hot is the surface area around the led.
And I'm thinking to reverse to process by:
make a hole - solder the led - fill the nano diamond from behind.
but I don't know how to seal it. Because I'm using aluminium MCPCB. Any idea?