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kakster said:
Now that is interesting. I had always assumed the better thermal properties of the LuxeonIII had been due to the move from an aluminuim slug to a copper part. So where does the improvement come from, if not the slug?
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Hell, it could be anything. Needless to say, Lumileds is probably keeping that a secret.
Besides, it's only a 2K/W improvement in thermal conductivity.
Theories:
1) Process improvement in the LED structure that slightly improves thermal transfer from the junction. This could be in the form of more pure materials, or an increase in the number/conductivity of solder blobs that attach the die to the silicon substrate
2) Better thermal conductivity of the silicon substrate between the die and slug.
3) Slightly better bonding material between the silicon substrate and slug.
4) No intentional improvement. Natural process improvement that has slightly improved the thermal conductivity.
That just covers the improvement in j-slug thermal resistance. The improved current carrying capability again, could be anything, but again, is likely a guarded secret (it keeps them ahead of the game).
Improved current carrying capabilities could be a result of the improved thermal management, purer materials/different materials mix, improved fabrication process, etc.