NewBie
*Retired*
Steen, who previously worked at General Motors, also told delegates that packaging of the LED sources is a crucial issue. He said that a "chip-on-board" concept, in which the primary optic is molded over both the LED chip and metal board (see figure), will be more suitable for car headlamps than the traditional LED package. Compared with the Luxeon package, which involves 12 parts and 13 process steps, the chip-on-board architecture requires only 5 parts and 4 processes, said Steen. This technology was developed by Global Light Industries, a German LED manufacturer acquired by Schefenacker in 2001.
Steen said that at least 13 vehicles showed an LED headlamp concept at the Detroit Auto Show in 2004. "The first-to-market race is on," he said. Each global region is actively involved in this race, while the first proposed production schedule is slated for late 2006.
http://www.ledsmagazine.com/articles/features/1/8/18
Steen said that at least 13 vehicles showed an LED headlamp concept at the Detroit Auto Show in 2004. "The first-to-market race is on," he said. Each global region is actively involved in this race, while the first proposed production schedule is slated for late 2006.
http://www.ledsmagazine.com/articles/features/1/8/18