Don't forget, cbt-90 is different from sst-90. No thermal pad and solder junction to transfer heat to the "star." Instead, the LED die is mounted to the "star" directly from the factory. The sst-90 has to transfer heat through its substrate to its thermal pad, which then is soldered to the thermal pad of a star, which is separated from the metal core with insulating layer. Even if you solder it directly to a heatsink, the heat still has to go through the substrate of the LED package, and through a solder joint, before it gets to the heatspreader/heatsink.
Think of the cbt package as current day processors. You don't see the actual chip anymore. Instead, they bond a heatspreader to the chip to quickly wick heat away from the chip. This integrated heat spreader is then attached to whatever thermal exchanger you are using, finned heatsink, water block, etc.
Remember how older, or less beefy processors were just a shiny silicon chip's backside showing? That would be like if we could buy bare LED dice and mount them to heatsinks ourselves.