Minimum distance on PCB between XP-G

You might want to look at this, particularly page 7 and pages 12-16. Although this document pertains to Rebels, the same principles apply with similar LEDs such as the XP-G, except of course the pad layout is different. The idea is to use thermal vias which conduct heat from the LED's thermal pad to the heat sink. The thermal vias let you use conventional FR-4 circuit boards instead of much more expensive MPCBs.

And to answer your question, you should be able to put the XP-Gs practically touching at either 150 mA or 350 mA, provided you have an adequate size heat sink to attach the circuit board to. The XP-G is very efficient, meaning it doesn't produce as much waste heat as less efficient LEDs. At 350mA roughly 40% of the input power comes out as light, not heat. At 150 mA roughly 45% is light, and the remaining 55% heat. In terms of heat, that's roughly 0.65 watts of heat at 350 mA, or 0.25 watts at 150 mA.
 
Thanks, great info. Would XP-G push out more lumens at 150mA rather than 350mA? I saw just 350mA on datacheet for minimum.
 
Thanks, great info. Would XP-G push out more lumens at 150mA rather than 350mA? I saw just 350mA on datacheet for minimum.
No, at 150 mA it would give fewer lumens. Here's my test results for the XP-G R5:

Cree_XP-G_bin_R5_Lumens_Chart.gif


As you can see, you get 145 lumens at 350 mA but only 65 lumens at 150 mA. Link to post with XP-G R5 test results
 
Sorry, I meant Lm/w figure 150mA vs 350mA.
Yes, the lm/w is higher at 150 mA compared to 350 mA. The figures are 138 lm/W at 350 mA and almost 152 lm/W at 150 mA. Remember however that these results are from a test of an R5. The lm/W for an R4 would be a little lower at both currents.
 
RobEU, I've replaced 2 photos you posted above with links - quite apart from possible copyright considerations, the images appear to be hotlinked, which is prohibited by Rule 3.
 
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