From my point of view the two main weaknesses of the ARC LS are the thermal transfer from the circuit/LED board to the housing and the optics mounting.
The heat transfer to the Alu disc is pretty good, but there are three interfaces from this disc to reach the body. I have observed, that the positive contact gets quite hot, which is probably caused by the limited heat transfer.
The other weakness is that the optics is directly pressed onto the emitter. This can lead to a leakage of silicone and farkle and makes the centering difficult and an optics spacing to improve the beam pattern impossible.
I have tried to fix this two points by potting an Al tube to the circuit board. This tube improves the thermal transfer to the body and is also used as optics holder.
Here are some images:
It worked really well. It is possible to center the optics outside the light and fix it with some drops of epoxy. The board stays also much cooler.
The heat transfer to the Alu disc is pretty good, but there are three interfaces from this disc to reach the body. I have observed, that the positive contact gets quite hot, which is probably caused by the limited heat transfer.
The other weakness is that the optics is directly pressed onto the emitter. This can lead to a leakage of silicone and farkle and makes the centering difficult and an optics spacing to improve the beam pattern impossible.
I have tried to fix this two points by potting an Al tube to the circuit board. This tube improves the thermal transfer to the body and is also used as optics holder.
Here are some images:
It worked really well. It is possible to center the optics outside the light and fix it with some drops of epoxy. The board stays also much cooler.