New XR-E has smaller die?

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Well sort of. Although it appears we now know what die that is we don't know why. There is a Gen II EZ1000 so why would they stick the EZ900 die in there?

Well what you failed to look at Mr Saab is that the Gen II EZ1000 die has only been released in green. I swear. :shakehead Some people.
 
It's kind of nice to see cree slipping in new advances in LED efficiency just because they can, but it would be nicer (for both us as users and the company's publicity) if they would tell us "oh, by the way, we got a new chip that puts out more power and is ALSO smaller!" instead of just making the switch while no one is looking :whistle:

So, do you think the smaller die is more likely an R2 than the larger die? I wonder how much of a difference it will make in beam patterns...:whistle:
 
It's kind of nice to see cree slipping in new advances in LED efficiency just because they can, but it would be nicer (for both us as users and the company's publicity) if they would tell us "oh, by the way, we got a new chip that puts out more power and is ALSO smaller!" instead of just making the switch while no one is looking :whistle:

So, do you think the smaller die is more likely an R2 than the larger die? I wonder how much of a difference it will make in beam patterns...:whistle:
There will be very very little difference in beam pattern. That may be why they didn't feel the need to say anything about it. I have no idea if those are genuine R2s. The message I get from some suppliers says that R2s are really hard to come by so you would think that if a distributor couldn't get them than the Chinese companies using "R2s" may be lying. But I think the "we can't get them" line is just an excuse because they don't want to get them. They also don't have M bin MC-Es.:thinking: I don't believe those are all that hard to come by. Also if that LED has the new die in it with the new enhancements one would think there would be an even greater chance of it being an R2 than if it had the old die.
 
It's kind of nice to see cree slipping in new advances in LED efficiency just because they can, but it would be nicer (for both us as users and the company's publicity) if they would tell us "oh, by the way, we got a new chip that puts out more power and is ALSO smaller!" instead of just making the switch while no one is looking :whistle:

wheres the fun then? the surprise will have been lost once they post anything relating to a preliminary datasheet...and we've seen enough of the XP-E rage haven't we?:nana:
 
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There will be very very little difference in beam pattern. That may be why they didn't feel the need to say anything about it. I have no idea if those are genuine R2s. The message I get from some suppliers says that R2s are really hard to come by so you would think that if a distributor couldn't get them than the Chinese companies using "R2s" may be lying. But I think the "we can't get them" line is just an excuse because they don't want to get them. They also don't have M bin MC-Es.:thinking: I don't believe those are all that hard to come by. Also if that LED has the new die in it with the new enhancements one would think there would be an even greater chance of it being an R2 than if it had the old die.

You are right they are not hard to get. I have seen many reels of R2 myself at one place, in different tints. So the supplier you mention probably has temporary shortage of component. Stocking these gems in large quantity is not a wise idea, pay premium price for R2 today, and when R3 is released you will have trouble with your R2s.
 
well, how about etched on the ceramic substrate? I don't really care where, as long as it is marked and obvious that cree marked it...

I wouldn't say it's impossible to etch on the SiC, since etching is done with lasers and the SiC esd diode is clearly visible, but it would take custom machinery that adjusts for the fact that it is shining through something, and it would also have to do so w/o damaging the glass and goo and stuff.

But good call, I'd forgotten binning is post-construction.

I still think that it would affect the beam of lensed throwers. if the die is noticeably smaller, (seriously, even if that copper square wasn't around it and the substrate and SiC were scaled to same aspect as the die, the dice are obviously different sizes) ... the beam should be noticeably smaller too, since any detail is multiplied as the image increases in size compared to the die. More light in a smaller area would be the result. Wait, isn't that what a thrower does? :duh2:
 
11vo552.jpg


right :cree XR E chip ez900 bin q5 (0.88mm)---left cree XR E chip ez1000 bin q5(0.98mm)

chip ez900 (0.88mm):
http://www.cree.com/products/pdf/CPR3DX.pdf
chip ez1000 (0.98mm):
http://www.cree.com/products/pdf/CPR3CR.pdf

Cree dont go to the bathroom without issuing a Product change notice, other than an XRC I dont know what this is but Cree would not just go substituing die without advising distributors and customers, the ramifications for such a move ie optics effects for major customers who have designed around the EZ1000 die(XRE) product would be potentially disastrous
 
It is possible that the beam is not much different and because of the lack of difference they thought they didn't need to tell anyone.
 
They probably did tell who it really did matter to, which was probably a very short list for such a minor change.
 
Cree dont go to the bathroom without issuing a Product change notice, other than an XRC I dont know what this is but Cree would not just go substituing die without advising distributors and customers, the ramifications for such a move ie optics effects for major customers who have designed around the EZ1000 die(XRE) product would be potentially disastrous
Well it sure isn't an XR-C that much is for sure. The only thing it could be is the new Gen II die. It seems to be more evolutionary than revolutionary so I don't necessarily think a public notice is necessary. This really is a teeny tiny change. It does seem a bit odd for Cree though. Are you going to alert Cree about this and report back? Otherwise I will do so.
 
i have many cree led flashlights with XR E package: 7x uf c3 p4 ,3 x uf c3 q5,2 X akoray106 ,uf a10 jetbeam jet 1 pro.....more than 20 flashlights with XR E

the 90% of my cree XR E package q5bin they have the ez1000 chip(0.98mm)
only 10% of my cree XR E package q5bin they have the ez900 chip(0.88mm)

the 80% of my cree XR E package p4 bin they have the ez900 chip(0.88mm)
only 20% of my cree XR E package p4 bin they have the ez1000 chip(0.98mm)

and all my romisen rc-g2 p2bin have the bad ez600 chip(0.58mm and only 2 wires)
http://www.cree.com/products/pdf/CPR3DH.pdf

i prefer the ez1000 chip,the ez900 chip it cannot resist more than 2.9 amp for more than 30 seconds

i prefer the ez900chip only for pocket powerful light sabres (romisen rc-g2 aspherical with small lens and 14500 battery@ 2.75 amp)

the chips of new cree leds with XP G package will be bigger than ez1000 (around 2mmx 2 mm)
 
My EZ-AA (4sevens pre-order, shipped on the first day) has the old-style, but all lights from my most recent DX order have small-die LEDs, including a WF-008 recoil thrower.

Now I know the ~10% difference shouldn't really be visible except in a very closely examined head-to-head, but every bit helps, and it is good to know my newest thrower has it. :)
 
I know it sounds like a crazy idea, but why not just ask Cree. I expect they will not ship with two different die sizes as the apparent source size will make a difference in the light distribution pattern. They only spec the FWHM, but that may change given the dome on the LED if you change the die size.

Cree will likely either say they use different size dies in the XRE or they will tell you that it is a clone (or XRC). Has anyone bought XRE from a direct CREE distributor and see a difference in die size?

...just had a thought, they provide pro-source optical models. Those are highly accurate and would be affected by die size. That tells me the die size is likely consistent, but lets ask Cree.

Semiman
 
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